Whether it is unbalanced or balanced magnetron sputtering target source, the utilization ratio of magnetic field work produced by static magnet to material will be less than 30%. General small-scale coating equipment mostly uses static magnetic field target. In view of this, the utilization of the target can be increased by changing the magnetic field, and the rotating magnetic field can be used on large equipment and precious target.

Generally speaking, magnetron sputtering technology uses the interaction of electron and magnetic field to produce a large number of ions impacting the target to complete sputtering, which can not be separated from the participation of inert gas. In today's magnetron sputtering equipment, the coil magnet has been replaced by a more efficient permanent magnet.

The cost of a good magnetron sputtering coating equipment is very high. The target source is equivalent to the heart of the coating equipment, but it is easy to be ignored by the buyer. Many friends pay attention to the measurement of the film thickness, the quality of the matching vacuum pump, and whether the MFC program is easy to use. In other aspects, if the heart is not powerful enough, it has a great impact on the overall effect. The cooling of the source is to ensure that the source is not damaged by high temperature Must be configured.

Magnetron sputtering can be divided into medium frequency, high frequency and direct current. The principle of medium frequency magnetron sputtering is the same as that of direct current magnetron sputtering. In the whole system of magnetron sputtering coating, the arrangement of cylinder, cathode and anode is related. The difference is that the anode of direct current magnetron sputtering is cylinder, while the intermediate frequency magnetron sputtering appears in pairs. As far as medium frequency magnetron sputtering is concerned, some metal products are usually plated. This kind of equipment is generally large-scale, which can put down a lot of products to be plated together, improving efficiency and film compactness.

Different ion density can be obtained by different magnetron sputtering technology. Changing the design of magnetic field can change the amount and distribution of ions. For magnetron sputtering technology, magnetic field is confidential. It is worth noting that the pulsed reactive magnetron sputtering has been widely used in the world, especially in Europe.

Coating machine (equipment) manufacturers are trying to improve the quality of the film, including plating speed, adhesion, uniformity, etc.; for the problem of film adhesion, there are many new technical methods, including bipolar pulse cleaning, high-pressure cleaning, etc., which can improve the effect of polishing and cleaning before coating. In recent years, the rapid development of filtered cathode arc technology has also improved the problem of uneven film.